<p><span class="legendSpanClass">HSINCHU</span>, Dec. 18, 2025 /PRNewswire/ -- AP Memory, a leading global design company providing customized memory solutions, today announced further advancements in its S-SiCap<sup>TM</sup> (Stack Silicon Capacitor) product line to address the increasing integration demands of AI servers and high-performance computing (HPC) systems. The S-SiCap<sup>TM</sup> portfolio includes two product categories ?봡iscrete silicon capacitors and interposers with silicon capacitors ??designed to support different system architectures and diverse application requirements.</p>  <p>The discrete silicon capacitors, S-SiCap<sup>TM</sup> Gen4, achieves a capacitance density of 3.8 關F/mm&sup2;, an increase of more than 50% over the previous generation. To meet the growing demand for higher performance and power efficiency in AI servers and HPC systems, S-SiCap<sup>TM</sup> Gen4 is the first to adopt embedded substrate packaging and is currently in the sampling and process validation stage. Mass production will be introduced progressively starting in 2026.</p>  <p>Meanwhile, the S-SiCap<sup>TM</sup> Interposer utilizes a silicon wafer as its substrate, embedding high-density silicon capacitors within the interposer. This significantly enhances signal integrity and power stability for high-speed I/O applications such as die-to-die, SerDes, and HBM. In collaboration with supply-chain partners, AP Memory has introduced a reticle-stitching technology to enlarge interposer die area allowing more IC chiplets to meet the growing demand for higher-integration advanced packaging solutions. The S-SiCap<sup>TM</sup> Interposer has completed customer packaging and reliability validation, entering four-reticle mass production at the end of Q3'25. Additional development projects are currently underway.</p>  <p><span class="xn-person">Ivan Hong</span>, President of AP Memory, stated, &quot;As AI and HPC applications continue to evolve rapidly, the industry is facing increasingly stringent requirements for power integrity and high-speed signal transmission. Through the S-SiCap<sup>TM</sup> product line, AP Memory delivers silicon capacitor technology in both discrete components and interposer-integrated forms, providing high performance, high integration, and design flexibility to meet the demands of next-generation AI and HPC systems.&quot; Looking ahead, AP Memory is actively developing silicon capacitor solutions for organic interposer architectures, further expanding its product portfolio.</p>  <p>About AP Memory</p>  <p>AP Memory (TWSE: 6531) is a global fabless design semiconductor company specializing in customized memory design and IP solutions.&nbsp; Products include IoT memory (IoTRAM<sup>TM</sup>), AI memory solutions (VHM<sup>TM</sup>), and silicon capacitors (S-SiCap<sup>TM</sup>). With strong R&amp;D capabilities, AP Memory is committed to providing high performance, low-power and innovative customized products and solutions for applications such as mobile communication, wearable, IoT, high-end mobile application, high-performance computing, and edge computing.</p>  <p>For more information, please visit&nbsp;<a href="https://www.apmemory.com/" target="_blank" rel="nofollow" style="color: #0000FF">www.apmemory.com</a>.</p>